工艺简介(Basic Process)：

该产品为闭孔性软质泡棉，系在PE 泡棉的成型过程中，采用内添加的方法混入导电填料，经辐射交联发泡而成；片材成型后，导电填料在片材内形成导电通路/网络，从而达到静电泄露的目的。

The said product is a close-cell, conductive soft foam. It is produced by compounding the PE resin with conductive fillers & blowing agents to extrude certain sheets, then cross-linking and foaming. Sheet being molded, the conductive filler forms conductive channel/ network internally, so as to achieve the purpose of static discharge.

技术性能指标(Technical Index):

特点(Characteristics):

1．内在固有导电通路/网络，防静电性能优良；

Excellent ESD effect because its interior conductive lattice;

2．不需利用环境湿度即可促使静电迅速泄露，防静电性能不受环境湿度影响；

Able to discharge electrostatic rapidly and independent to environmental humidity

3．防静电时效性为性防静电,不受环境湿度影响；

Permanent ESD effect, Not affected by ambient humidity;

4．导电性优良：静电指标值10³—10⁹ Ω/sq；

Excellent conductive effect: resistivity value 10³—10⁹ Ω/sq；

5．缓冲减震性能优良：独立而细密的闭合泡孔；

Superior buffering and cushioning performance: independent and meticulous closed cell;

6．耐高温：EPE、IXPE耐温120°C；

High temperature resistance: EPE,IXPE resists a maximum temperature of 120°C

7．耐化学腐蚀：耐有机溶剂、酸、碱等；

Chemical corrosion-resistant: resistant to organic solvents, acids, alkalis, etc;

8．无化学腐蚀：对元器件及包装物无任何腐蚀;

Non-chemical corrosion: free chemical corrosion to the electronic devices and the packing materials;

9．隔热、隔音，不吸水、防潮；

Heat insulation, sound insulation, non-absorbent, moisture-proof;

10．良好的二次加工性能，容易成型

Satisfactory performance of secondary processing, easy to shape.

用途及应用领域（Use and applications）:

1．元器件、板卡、模块进行封装的电子、通讯行业

The use of the aforementioned components, boards, modules packages, electronics, telecommunications industry:

2．航空、航天、通讯、军事、化学化工等工业中的应用。

Applications in aviation, aerospace, communications, military ordnance and chemical industry.

3．优点：传统的中空刀卡，使用寿命短，且在使用过程中很容易将电子器件与手划伤。导电IXPE泡棉具有良好的缓冲性和柔韧性，即不具损伤性，使用寿命也是中空板等的几位到几十倍长；集防静电、缓冲、周转于一身，导电泡棉做成的硬盘，手机、主板、内存条等托盘具有传统的注塑托盘所不可替代的优点。

Advantage: compared with traditional hollow board, conductive IXPE foam board is not only flexible and buffering, but also non-traumatic to electric devices and hands, while traditional hollow board is very easy to scratch electronic devices and hａnd in the process of use. The most important thing is that IXPE foam’s life is as several times longer as hollow boards；Compounded with anti-static, buffering and circulating properties, conductive IXPE foam trays for Hard Disks, Cell phones, Motherboards and Memory Bar have irreplaceable advantages to the traditional injection molding trays, which make sure the maximum protection to those devices when circulating.