Operation

Bonding Principle

Chip fed by fixture or tray and Substrate fed by reel to reel. Automatic Dispensing, chip loading, chip attachment and bonding.

Chip fed by fixture or tray and Substrate fed by reel to reel. Automatic Dispensing, chip loading, chip attachment and bonding.

Antenna dimension

Chip Dimension

Antenna: ≤100mm×60mm

Chip:0.4mm×0.4mm～2mm×2mm

Vision System

PR System

Dimiation

1200mm*500mm*1200mm

Additional function

inline functional test

Weight

260 kg

substrate Material

PET PVC PAPER

Electrical Power

500 W

adhesive

ACA NCA ICA

Air Power

5bar≤P≤7bar

Productivity

700—800 pcs/hr

Bonding Force

50—500g

Attach Accuracy

±20 μm

Bonding Temperature

50—300 ℃